Application of SHAPAL-HI-M in the aviation field

SHAPAL-HI-M (Machinable Aluminum Nitride) plays an important role in the aerospace industry, and its unique characteristics provide many advantages for aerospace engineering:
High temperature resistance: In aerospace engineering, components such as engines, turbines, and nozzles often need to operate in extreme high temperature environments. SHAPAL-HI-M has excellent high-temperature resistance, can maintain stability under high temperature conditions, and is not prone to deformation or oxidation. Therefore, it is widely used in the manufacturing of high-temperature components, such as heat shields and flow deflectors for jet engines.
Corrosion resistance: Aerospace vehicles are susceptible to various corrosive media during flight, such as wet oxygen, wet chlorine, etc. SHAPAL-HI-M has excellent corrosion resistance and can resist the erosion of these corrosive media, ensuring the reliability and lifespan of aerospace vehicles.
Lightweight design: Aerospace engineering has strict requirements for material weight, and lightweight design has become an important strategy. SHAPAL-HI-M has low density and excellent mechanical properties, which can be used to manufacture lightweight components such as structural components and casings of aerospace vehicles, effectively reducing the weight of the entire system.
Thermal conductivity: In aerospace engineering, thermal management is an important issue. SHAPAL-HI-M has good thermal conductivity, which can effectively conduct and disperse the heat generated by components, help maintain the stability of internal temperature in aerospace vehicles, and improve the thermal efficiency and performance of the system.
High strength: Aerospace engineering requires extremely high strength and durability of materials. SHAPAL-HI-M has excellent mechanical properties, such as high strength and rigidity, and can withstand various loads and vibrations of spacecraft during flight, ensuring the structural integrity and safety of the spacecraft.