SiC (Silicon Carbide) Waffer Chucks — Precision Chucking Solutions for High‑Temperature & High‑Power Processes

Silicon carbide (SiC) combines high thermal conductivity, low thermal expansion, superior hardness and excellent chemical stability — making it an ideal material for wafer carriers and chucks used in RTP, CVD, etch, and inspection equipment. We offer end-to-end services from prototype and engineering validation to volume production, including cleanroom washing, DLC or other surface treatments, and full inspection reports.

Why choose SiC for wafer chucks (core advantages)

High thermal conductivity: Rapid and even heat spread reduces hotspots and thermal stress in high‑power/temperature processes.

Low coefficient of thermal expansion (CTE): Better thermal match to silicon reduces warpage and dimensional drift during thermal cycles.

Wear & chemical resistance: Resists plasma, chemical cleaning and particle generation for longer service life.

High flatness & light weight: Achievable optical‑grade flatness for precision alignment while reducing inertial load for high-speed positioning.

Common SiC chuck types & typical applications

Pin / Pin‑chuck: Minimal-contact or point contact solutions for processes that require limited surface contact (etch, certain inspections). Replaceable pin designs available for serviceability.

Ring / Groove chuck: Non‑marking ring or groove designs for improved thermal uniformity and no-scratch holding — ideal for high‑temperature anneal and RTP processes.

Porous / Vacuum chuck: Engineered micro‑pore or internal channeling to enable uniform vacuum holding across the wafer.

Carrier trays / cassettes: SiC trays and carriers for batch furnaces, CVD lines and handling systems where chemical and thermal resistance matter.

Our manufacturing & quality assurance process

Design for Manufacturing (DFM) review and thermal/structural guidance

Material selection (SiSiC / SSiC / CVD SiC) based on process demands

Rough machining → precision grinding → lapping / polishing

Surface treatment or coating as specified

Cleanroom washing, packaging and handling

Inspection and test: CMM, flatness mapping, vacuum leak/holding test, material certification

Typical applications

RTP / high‑temperature anneal carriers

CVD / epitaxy wafer carriers and holders

Plasma etch and high‑power processing chucks

Lithography alignment platforms and inspection chucks

Batch furnaces, carriers and transfer trays

What advantages does SiC have over quartz or other ceramics for wafer chucks?

SiC generally offers higher thermal conductivity, greater hardness and improved chemical resistance versus many alternative ceramics, which leads to better thermal uniformity, lower particle generation and longer life in aggressive processes.

Contact Us for Custom SIC Parts

We provide customizable ceramic components throughout the semiconductor process, leveraging our experience serving many top semiconductor companies. Load your drawing or contact our engineer for a fast technical review and sample quote.