In high-power electronics and semiconductor projects, use aluminum nitride (AlN) ceramics with thermal conductivity up to 170–230 W/m·K to efficiently handle both heat dissipation and electrical insulation. Compared with beryllium oxide (BeO), AlN poses no health risks during processing or use, making it a safer choice for semiconductor equipment.
Unlike machinable ceramics, aluminum nitride requires specialized sintered diamond tooling for machining. With years of project experience, we are capable of handling complex geometries and achieving extremely tight tolerances, while effectively minimizing common issues such as edge chipping and surface whitening. This allows us to provide reliable technical support for your project.
The following is a table of performance parameters for our standard AlN materials. The data is based on internal testing and batch statistics and is for design reference only. Actual values may vary slightly due to sintering conditions and batch differences.
| Mechanical properties | Unit | AlN |
|---|---|---|
| Density | g/cm³ | 3.34 |
| Vickers hardness | HV | 1100 |
| Bending strength | MPa | 400 |
| Compressive strength | MPa | 2500 |
| Toughness | MPa·m¹/² | 3.5 |
| Elastic modulus | GPa | 310 |
| Poisson's ratio | — | 0.22 |
| Young's modulus | GPa | 330 |
| Thermal performance | Unit | AlN |
|---|---|---|
| Thermal conductivity | W/(m·K) | 179.2 |
| Maximum service temperature | °C (carrying idler) | 1350 |
| Specific heat | J/(kg·K) | 720 |
| Thermal Shock | °C (Put into water) | 350 |
| CTE(30°C~300°C, ppm/°C) | 1 × 10⁻⁶/°C | 4.06 |
| CTE(30°C~500°C, ppm/°C) | 1 × 10⁻⁶/°C | 4.85 |
| Electrical characteristics | Unit | AlN |
|---|---|---|
| Dielectric constant | 1MHz | 7.4 |
| Dielectric loss | 1MHz | 1.6 × 10¹⁴ |
| Breakdown voltage | kV/mm | 18 |
| Dielectric strength | kV/mm | ≥20 |
| Volume resistivity @ 25 ° C | Ω · cm | 2.1 × 10¹⁶ |
Shapal Hi-M is a machinable aluminum nitride ceramic that combines the high thermal conductivity of aluminum nitride with excellent machinability. Unlike conventional AlN ceramics, it can be precision machined using standard metalworking tools, significantly reducing manufacturing time and cost.With its high thermal conductivity, electrical insulation, and good chemical stability, Shapal Hi-M is widely used in electronics, semiconductor equipment, and precision engineering applications.
Yes, Aluminum Nitride (AlN) can replace Beryllium Oxide (BeO) in many applications, but not in all cases.
BeO generally provides higher thermal conductivity (up to ~330 W/m·K), so it may still be preferred in applications requiring the maximum possible heat dissipation.
In practice, AlN is widely used today as a safer and more practical alternative to BeO in many electronic and semiconductor applications.
Yes. We support prototype development and small-to-medium batch machining for Aluminum Nitride (AlN) components.
Our manufacturing process is designed to handle custom parts based on technical drawings, making it suitable for early-stage product development, design validation, and low-volume production. Customers can start with prototype quantities to test performance before moving to larger production runs.
Typical capabilities include precision machining of complex geometries, tight tolerances, and customized dimensions for applications in electronics, semiconductor equipment, and thermal management systems.
No, machining Aluminum Nitride (AlN) is generally difficult due to its high hardness and brittle nature.
Processes such as slotting, drilling, and machining complex geometries require specialized tooling and optimized machining parameters. Inexperienced machining can easily lead to defects such as edge chipping, surface whitening, or micro-cracks, which may affect both appearance and performance.
In addition, when AlN is ground on a grinding machine, the material may release a noticeable odor during the grinding process. This is a common challenge in AlN processing and usually requires proper ventilation and process control. In contrast, CNC machining processes typically do not produce this odor.
When selecting between Aluminum Nitride and Aluminum Oxide ceramics, the decision mainly depends on thermal performance requirements and cost considerations.
For applications requiring high thermal conductivity and efficient heat dissipation, aluminum nitride is generally the best choice due to its excellent heat transfer capability.
When cost and mechanical strength are the primary considerations, alumina ceramics are often preferred because they are more economical and typically offer higher mechanical strength.
For precision machining of Aluminum Nitride (AlN), our manufacturing capabilities allow us to achieve very fine structural features under optimized machining conditions:
The exact limits may vary depending on the part geometry, dimensions, and tolerance requirements. For extremely thin or complex structures, design optimization may be recommended to ensure machining stability and reduce the risk of chipping or breakage.
Macor is a machinable glass-ceramic made from fluorophlogopite mica crystals embedded in a borosilicate glass matrix. This composition gives it a rare
combination of metal-like machinability, excellent electrical insulation, low thermal conductivity, and stability up to 1000°C (no load) while maintaining very tight tolerances.
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