Advanced semiconductor equipment operates in high-temperature, vacuum, plasma, and ultra-clean environments. Ceramic material purity, thermal stability, and precision directly affect chip yield and reliability.
Semiconductor equipment and processes (such as ion implantation systems, ion source assemblies, PVD/CVD chambers, thin film deposition, and lithography machines) utilize a large number of advanced ceramic and optical glass components.
Using materials including Al₂O₃, AlN, SiC, quartz, and Zerodur, we develop customized prototype components designed to deliver long-term performance and reliability.
With our advanced 5-axis machining capabilities and years of manufacturing experience, we can transform your specific design requirements into high-precision components and provide strong support for semiconductor prototype development.
Our advanced ceramic components are widely used in semiconductor equipment, including photolithography systems, plasma etching equipment, CVD/PVD deposition chambers, wafer fabrication tools, and thin film deposition systems.
Our advanced 5-axis machining and years of experience enable us to produce semiconductor components with flatness up to 1 μm.
The following examples demonstrate custom precision ceramic components manufactured for semiconductor equipment and related high-precision applications.
Our machining services deliver high-value, high-precision prototype components for semiconductor manufacturing processes.
| Capability | MACOR | Aluminum Nitride | Alumina | Silicon Carbide | Silicon Nitride |
|---|---|---|---|---|---|
| Flatness | 0.002mm | 0.001mm | 0.001mm | 0.001mm | 0.001mm |
| Concentricity | 0.005mm | 0.005mm | 0.005mm | 0.005mm | 0.005mm |
| Cylindricity | 0.001mm | 0.001mm | 0.001mm | 0.001mm | 0.001mm |
| Parallelism | 0.001mm | 0.001mm | 0.001mm | 0.001mm | 0.001mm |
| Wall (Min) | 0.05 | 0.1 | 0.1 | 0.2 | 0.4 |
| Hole Ø (Min) | 0.05 | 0.1 | 0.1 | 0.1 | 0.3 |
| Slot (Min) | 0.2 | 0.2 | 0.2 | 0.5 | 1.0 |
| Thread (Min) | M1.2 | M1.6 | M1.6 | M1.6 | M2.0 |
| Polishing | Ra0.03 μm | Ra0.03 μm | Ra0.02 μm | Ra0.005 μm | Ra0.005 μm |
| Sandblasting | 3.0 | 3.0 | 3.0 | 2.0 | 2 |
| Capability | Zerodur | Optical Glass |
|---|---|---|
| Flatness | 1/20 λ | 0.001mm |
| Concentricity | 0.005mm | 0.005mm |
| Cylindricity | 0.001mm | 0.001mm |
| Parallelism | 0.001mm | 0.001mm |
| Min. Wall Thickness | 0.2 | 0.2 |
| Min. Hole Diameter | 0.1 | 0.1 |
| Min. Slot Width | 0.3 | 0.2 |
| Min. Internal Thread | M2.0 | M2.0 |
| Polishing | Ra0.005 μm | Ra0.002 μm |
| Sandblasting | 3 | 3 |
Disclaimer: Actual achievable tolerances may vary depending on material properties, part geometry, and dimensions.
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