Advanced semiconductor equipment operates in high-temperature, vacuum, plasma, and ultra-clean environments. Ceramic material purity, thermal stability, and precision directly affect chip yield and reliability.
Semiconductor equipment and processes (such as ion implantation systems, ion source assemblies, PVD/CVD chambers, thin film deposition, and lithography machines) utilize a large number of advanced ceramic and optical glass components.
Using materials including Al₂O₃, AlN, SiC, quartz, and Zerodur, we develop customized prototype components designed to deliver long-term performance and reliability.
With our advanced 5-axis machining capabilities and years of manufacturing experience, we can transform your specific design requirements into high-precision components and provide strong support for semiconductor prototype development.
Our advanced ceramic components are widely used in semiconductor equipment, including photolithography systems, plasma etching equipment, CVD/PVD deposition chambers, wafer fabrication tools, and thin film deposition systems.
Our advanced 5-axis machining and years of experience enable us to produce semiconductor components with flatness up to 1 μm.
In semiconductor manufacturing, material selection is critical to ensure high precision, thermal stability, chemical resistance, and ultra-clean performance. The following advanced ceramics and glass materials are widely used across wafer processing, etching, deposition, and inspection systems
The following examples demonstrate custom precision ceramic components manufactured for semiconductor equipment and related high-precision applications.
Our machining services deliver high-value, high-precision prototype components for semiconductor manufacturing processes.
Our advanced ceramic and glass machining processes include milling, grinding, CNC machining, polishing, and precision cleaning. The following table outlines the key processing steps and the achievable tolerance levels for critical parameters such as flatness, parallelism, roughness, and positioning accuracy.
| Key Process Steps | Technical Parameters | Reachable Values |
|---|---|---|
| Hard Machining - Milling | Flatness, Parallelism, Ra | Flatness < 1 μm; Ra ≥ 0.05 μm |
| Grinding | Flatness | 5 μm < Ø 200 mm / 10 μm > Ø 200 mm |
| Grinding | Parallelism | 5 μm < Ø 200 mm / 10 μm > Ø 200 mm |
| Grinding | Roughness | Ra 0.15 μm – 0.6 μm |
| CNC Precision Machining | Hole / Groove Positioning Accuracy | ≤ 0.05 mm |
| Polishing | Parallelism, Roughness | Flatness < 1 μm; Parallelism < 1 μm |
| Cleaning & Packaging | Cleanliness | ISO 5/100 cleanroom |
| Material | MACOR | Aluminum Nitride | Alumina | Silicon Carbide | Silicon Nitride | Zirconia | SHAPAL Hi M |
|---|---|---|---|---|---|---|---|
| Roundness | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 |
| Internal Thread | M1.2 | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 |
| Flatness | M1.2 | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 | 0.001 |
Disclaimer: Actual achievable tolerances may vary depending on material properties, part geometry, and dimensions.
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